PCB 的UL 认证
在印制电路板的 UL 报告中(会给出一张表格(列出UL 对各种特定类别的板材！如 CEM-1, CEM-3, FR-1, FR-4 等，及指定经 UL 认证的基材型号！如 KB-5150, KH-111F, R-8700, CCP-508等等，使用单面板或双面板工艺！Single Sided, Double Sided，作出的测试认证(并列出所对应的制造厂型号。
在印制电路板的元件面！Top over Layer，应印制黄卡规定的制造厂标记、制造厂型号及阻燃等级等。对于采用单面板！如 KB-5150 的 CEM-1，材质的“灌孔”板(必须是采用双面板工艺！DS，。
对印制电路板作承认时(除了基材之外(供应商还应提供阻焊剂！绿油，的 UL 认证资料。
以下是几个供应商的 UL 资料，
1 E214800 WANG’S
2 E213009 DIFEIDA
Spacing and PWB Coating
Spacing of Electrical Parts
19.1.4 For an uncoated printed-wiring board, the minimum spacing between adjacent foil traces shall be at least as specified in Table 19.1. For Printed wiring boards that are covered with
potting compound or a conformal coating, the minimum spacing between the adjacent foil traces prior to coating shall be as specified in the first row of Table 19.1.
Table 19.1 Spacings for indoor and outdoor locations
Maximum voltage between parts, Vrms (Vpeak=1.4 Vrms)
050 Locations / dimensions in 150 300 450 600 750 900 1050 1200
millimeters Vrms Vrms Vrms Vrms Vrms Vrms Vrms Vrms Vrms
Parts potted or - / - / 0.3 - / - / - / - / - /
subsequently coated 0.18 a a 0.7 0.8 0.8 3.2 4.2
a) Or as determined from the investigation of the Conformal Coating, whichever is greater.
19.1.5 Where a conformal coating is used as described in 19.1.4, the conformal coating shall comply with the requirements in the Standard for Polymeric Materials -- Use in Electrical Equipment Evaluations, UL 746C.
18.1 A printed wiring board shall be intended for the application. The criteria shall include:
a) The bonding of the foil to the substrate for the minimum conductor width and maximum un-pierced area as required by the
Standard for Printed Wiring Boards, UL 796;
Exception: Printed wiring boards that are completely encased in potting compound or conformal coating are not required to
additionally comply with UL 796.
b) The temperatures measured in the Temperature Test, Section 25, shall be less than the temperature rating of the substrate as
required by the Standard for Polymeric Materials - Long Term Property Evaluations, UL 746B; and
c) The flammability of the printed wiring board substrate shall be no less than V-1 in accordance with the Standard for tests for
Flammability of Plastic Materials for Parts and Appliances, UL 94.
a) 铜箔的可焊性(最小线宽和最大非贯通面积符合UL 796 “印制线路板标准”：
b) 在第25节正常温度测试中测得的温度不应高于UL746B“聚合材料 ； 长期特性评价标准”对感光层的温度额定值：
c) 印制电路板的阻燃等级应优于UL 94“零件和器具用塑料材料的可燃性测试标准”的V-1级。
Coating for Use on Recognized PWB – R/C (QMJU2) E69262
TAIYO INK MFG CO LTD
Coat Mtl Thk Sold Lts
Min Max UL94 Lam Thk Max Max
Mils Mils Flame ANSI Oper Time
Dsg Col (Mics) (Mics) Class Type In. (mm) Temp Sec
Resist coatings for use on Recognized printed wiring boards, furnished in the form of
one component thermally curable liquid.
PSR-2000AL/ GN 0.31 1.97 V-0 FR-4 0.008 (0.20) *14 *14
CA-23 (8) (50)
PSR-2000AN/ GN 0.31 1.97 V-0 FR-4 0.008 (0.20) *8 *8
CA-25AA (8) (50)
WANG'S CIRCUIT BOARD CO LTD
Cond Width Max Max
Min Cond Area Solder Oper Meets C
Min Edge Thk SS/ Diam Limits Temp Flame UL796 T Type mm(in) mm(in) mic(mil) DS mm(in) C sec C Class DSR I Single layer printed wiring boards.
WS-1 0.3 (0.012) 0.43 (0.017) 34 (1.34) SS 645.2 (25.4) 260 5 130 V-0 All - WS-2 0.3 (0.012) 0.43 (0.017) 34 (1.34) DS 645.2 (25.4) 260 5 130 V-0 All -
JIANGSU DIFEIDA ELECTRONICS CO LTD
Cond Width Max Max
Min Cond Area Solder Oper Meets C
Min Edge Thk SS/ Diam Limits Temp Flame UL796 T
Type mm(in) mm(in) mic(mil) DS mm(in) C sec C Class DSR I
Single layer printed wiring boards.
DFD-1 0.24 (0.009) 0.3 (0.012) 34 (1.34) SS 25.4 (1.0) 260 6 130 V-0 All -
DFD-2 0.24 (0.009) 0.3 (0.012) 34 (1.34) DS 25.4 (1.0) 260 6 130 V-0 All -
DFD-3 0.46 (0.018) 1.38 (0.054) 34 (1.34) SS 25.4 (1.0) 260 10 130 V-0 All -
Wiring, Printed - Component
The devices covered under this category are incomplete in certain constructional features or restricted in performance capabilities and are intended for use as components of complete equipment submitted for investigation rather than for direct separate installation in the field. THE FINAL ACCEPTANCE OF THE COMPONENT IS DEPENDENT UPON ITS INSTALLATION AND USE IN COMPLETE EQUIPMENT SUBMITTED TO UNDERWRITERS LABORATORIES INC.
The category covers printed wiring boards for use as components in devices or appliances. The boards may use organic or inorganic base materials in a single or multilayer, rigid or flexible form. Circuitry construction may include etched, die stamped, precut, flush press, additive, and plated conductor techniques. Printed-component parts may be used.
The suitability of the pattern parameters, temperature and maximum solder limits shall be determined in accordance with the applicable end-product construction and requirements. Minimum Cladding Conductor Width — The minimum width of any conductor spaced more than 0.015 in. (0.38 mm) from the edge of the printed wiring board.
Minimum Edge Cladding Conductor Width — The minimum width of any conductor parallel with and
not spaced more than 0.015 in. (0.38 mm) from the edge of the printed wiring board. Cladding Conductor Thickness — The minimum metallic cladding thickness of the conductor. Number of Clad Sides — Indicates whether the printed wiring boards have a pattern on one side (single sided) or on both sides (double sided).
Maximum Area Diameter — The maximum unpierced conductor area of a printed wiring board is judged by the diameter of the largest circle that can be inscribed within the pattern. Solder Limits — Unless designed for hand soldering only, each printed wiring board construction is assigned a maximum temperature and dwell time. The tabulated levels are the maximum temperature and cumulative time conditions to which the boards may be subjected to during assembly of components.
Maximum Operating Temperature — The maximum continuous use temperature that the printed wiring board may be exposed to under normal operating conditions.
UL 94 Flammability Classification — Processed printed wiring boards with or without applied coatings, finishes, etc., as supplied to the device or appliance manufacturer, may be tested and classified in accordance with the Standard for Flammability of Plastic Materials for Parts in Devices and Appliances — UL 94, at the option of the manufacturer.
Where such testing has been conducted, the burning test classification may be indicated on the printed wiring board either by the full classification designation such as "94HB,""94V-0,""94V-1,""94V-2,""94VTM-0,""94VTM-1," or "94VTM-2," or by a code designation, the significance of which is recorded in UL files.
Conductor finishes — Metallic plating on conductors, contact fingers, plated thru holes, etc., may be tested at the option of the manufacturer.
This category covers flexible printed wiring which is defined as changes in the cross-sectional configuration such as would be caused by right angle conductors, mid-point connections, etc. This category does not cover flexible printed wiring where the cross-sectional configuration is the same for the entire length of the product. The later construction is covered under the category Component — Appliance Wiring Material (AVLV2).
Direct Support of Current — Carrying Parts - A printed wiring board that meets the minimum UL
796 levels of direct — support of current carrying parts is identified to enable the OEM to select appropriate printed wiring boards for use in products.
The required performance levels are shown below:
PERFORMANCE PROFILE LEVELS OF
BASE MATERIAL OF PRINTED WIRING BOARDS THAT PROVIDE
DIRECT SUPPORT OF CURRENT — CARRYING PARTS
Test # Unit 94V-0, 94V-1, 94V-2, 94HB Thkns In. +
High Current Arc Ignition Max PLC 3 Actual @
Hot Wire Ignition Max PLC 4 Actual @
Volume Resistivity — Dry Min Meg- 50 1/16
Volume Resistivity — Wet Min Meg- 10 1/16
Dielectric Strength — Dry kV per mm 6.89 1/16
Dielectric Strength — Wet 6.89 1/16
Comparative Tracking index Max PLC 4 1/16
Heat Deflection Degrees C * 1/8
@Actual thickness or minimum thickness of material being considered.
*Not required for thermoset; for thermoplastics, at least 10 degree C (18 degree F) above rated operating temperature with 90 degree C (194 degree F) minimum value.
#Testing is to be as described in the Standard for Polymeric Materials - Short Term Property Evaluations, UL 746A.
+Test sample thickness on which the index is to be based.
Comparative Tracking Index (CTI) — Expressed as that voltage which causes tracking on a printed wiring board base material after 50 drops of a 0.1% ammonium chloride solution has fallen:
CTI Range-Tracking Index (TI in Volts) Assigned PLC
600 and greater 0
400 and up to 600 1
250 and up to 400 2
175 and up to 250 3
100 and up to 175 4
Less than 100 5
The CTI Performance Level Category (PLC) of a printed wiring board is dependent on the CTI PLC of the base material used to make the board. The CTI PLC may be identified to facilitate OEM selection of printed wiring boards for applications in which the CTI rating is significant. The following abbreviations or symbols are used on the individual Recognitions.
Cond. Width Conductor Width
DS Double or single single sided
Max Area Diam Maximum Area Diameter
Max Oper Temp Maximum Operating Temperature
Min. Edge Minimum Edge
SS Single sided
Sold Lts Soldering Limits
Cond Thk Conductor Thickness
UL 94 Flame Class UL 94 Flammability Classification
Dir. Sup. Direct Support of Current Carrying Parts
CTI Comparative Tracking Index
A triangle Symbol is marked on those products within a given type designation that comply with direct support of current-carrying parts performance level requirements of UL 796. "All" is used
to indicate that all base materials under that type designation comply with direct support of current-carrying parts performance level requirements of UL 796.
The CTI PLC rating of a printed wiring board may be marked on the board or a CTI rating may be assigned to a type designation.