Green Environmental program

By Kathleen Lawson,2014-01-09 11:17
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Green Environmental program

Green Environmental Program



    Keltron is embarking on a program to phase in lead free components and process for its products. This is in line with Keltron’s Green Environmental Program and also in response to international

    legal developments (including but not limited to the European Union’s WEEE and RoHS

    directives) that will act to restrict the use of lead (Pb) in electronic components, assemblies and other related components. To begin on the lead free journey, Keltron will collect all the information on lead free and manufacture in lead free process, technology, material that are in existence or being developed in the market.


    Keltron can supply electronic components, connectors, headers, sockets and cables on lead free or stEnvironment-related Substances to be controlled on Jul 1 2005.

Expectations from Keltron

    ; We will provide customer a milestone chart or plan on how it intends to meet the

    timelines of the proposed legislative requirements for lead free.

    ; We will provide upfront information and regular updates on any cost impact of the parts

    due to lead-free conversion. Our supplier must work with Keltron to minimize the impact

    of such a conversion on cost and manufacturing during any transition periods.

    ; We will identify issues relating to quality, yield or long term reliability as early as

    possible and update our customer on those information.

    ; Lead free solder alloys and soldering processes are likely to result in higher assembly

    temperatures. We will develop components and product that are both lead free and can

    withstand these higher assembly temperatures. Note : plastic materials used in these

    components must also comply with the halogen free requirements of the new RoHS


    ; We will provide a product identification/part numbering plan to indicate which kind of

    metal alloy is used on a product in order to facilitate rework, repair and recycling and to

    reduce the likelihood of errors.


    Green Environmental Program

    Lead Free Process Introduction Schedule

    “Free-Lead” Process Introduction Schedule

    R2004 2005 eDivision N Timing min 111111O Item a1 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 8 9 Change 0 1 2 0 1 2 k


    Free-lead material Producti1 development on & QA

    review meeting Dept.

    Present material

    composition Productianalsis or 2 on & QA information Dept. collected & New

    material research

     ProductiPlot run for new 3 on & RD material Dept.

     ProductiRepeatability test 4 on & RD for new material Dept.

    Repeatability test QA 5 for new material Dept.

     Producti6 Material approved on & QA


    Engineering RD 7 Change Dept.

    BOR.BOM RD 8 Changed for new Dept. material

     Sales Sample Re-Dept. & 9 approve by QA customer Dept.

     WarehouLead-free product se 1introduce in entire Producti 0 production line & on QA Product delivery Dept. P.S. Remark

     Planning line : Actual Implement line :

    Approved : Mike Wu Checked : Jason Lin Draw : James Zhou


Green Environmental Program

    Lead free Affected EEE is not allowed to contain the following materials (Material groups)

    Electric and Electronic Equipment is defined as “EEE”

    ; Lead exceptions as follows

    - Lead in glass from CRT (cathode ray tubes)

    - Lead in glass from fluorescent tubes

    - Lead in alloys of steel with a lead content up to 0.35 % weight

    - Lead in alloys of aluminium with a lead content up to 0.4 % weight

    - Lead in alloys of cooper with a lead content up to 0.4 % weight

    - Lead in solder with a high melting point, that means tin-lead solder alloy with

    more than 85 % (weight) lead

    - Lead in solder for servers, memory devises and storage-array systems (until 2010)

    - Lead in solder for network infrastructure equipment for signal transfer, signal

    processing, transmission and network management in the area of


    - Lead in ceramic electronic components

    ; Mercury exceptions as follows

    - Mercury in compact fluorescent lamps with a maximum quantity of 5 mg per


    - Mercury in fluorescent lamps for general use, with am maximum quantity of 10

    mg (Halogen Phoshpate), 5 mg (Triphosphate with normal life span), 8 mg

    (Triphosphate with extended lifespan)

    - Mercury in fluorescent tubes for special use

    - Mercury in other lamps

    ; Cadimium exceptions as follows

    - Cadmium surface coating, when not strictly forbidden by guideline 76/69/EWG.

    ; Chrome (VI) exceptions as follows

    - Chrome (VI) compounds as corrosion protection for carbon steel for use in

    cooling systems in absorbtion refrigerators.

    ; Polybrominated biphenyls (PBB)

    ; Polybrominated diphenyls (PBDE)

The following are groups of materials and limits of concentration


    Green Environmental Program

     Antimony trioxide

     Arsenic and its compounds

     Lead and its compounds [ ? 0.1 Grew. % ]

     Polybrominated buphenyls and diphenylethers [ ? 0.1 Grew. % ]

     Cadmium and its compounds [ ? 0.1 Grew. % ]

     Chlorinated paraffins

     Chromium (VI) compounds


     Bis(2-ethlhexy)phthalate (Diethylhexylphthalate, DEHP)

     Dimethylformamlde (DMF)

     Synthetic mineral fibers classified as carcinogenic

     Mercury and its compounds [ ? 0.1 Grew. % ]

     Radioactive substances

     Beryllium and its compounds

     Sulfur hexafluoride (SF) 6

    General Material Requirements


    ItePrintinCeramAdditig Testing Item Plastic Matal Glass Paper Textile Wood Application m g ic ve Materi


    Colouring Cadimium(Cd) agent,

    1 Cdmium * * * * * * * * * * Stabilizer, Compounds Plating PVC



    PVC Lead(Pb) stabilizer,

    2 Lead * * * * * * * * * * soldering, Compounds glass,


    Lutricants Mercury)Hg) Preservatives,

    3 Mercury * * * * * * * * * * Pigments, Compounds Catalyst

    4 Hexavalent-* * * * * * * Pigments,


    Green Environmental Program


    ) Compounds Catalysts,






    Flame 5 PBB/PBDE * * * * retardants

    Lubricants, Polychlorirared Heating 6 biphenyls(PCBs* * * * medium, Oil ) for capacitors Polychlorinated Lube icants, 7 naphthatens * * * Preservatives, calagory(PCN) Paints

    Flame Chlorinated 8 * * * * retardants, paraffins Plasticizer 9 Mirex * * * * Pesticide

    Used for

    wood, lextile, 10 Formaldehyde * * leather as



    11 chloride(PVC) * and PVC blends

    Organic 12 * * Insecticide Uncompounds

    Insuistors, 13 Asbestos * Fobers

    AZO 14 * * * Dyestuff compounds

    15 ODC *

    Flame 16 TBBP-Abis * * * * retardats Lead+Cd+Hg+C

    17 r6 (or packing


    Battery content 18 restrictions


    Green Environmental Program

    Lead Free Plating Spec.

1. Acceptable substitutes for finishes containing lead (Pb)

    Acceptable substitutes for lead finishes on electrical components, heat sinks and printed

    circuit boards may include but are not limited to:

    1. Fused tin (Sn) with or without nickel (Ni) under plate

    2. Tin (Sn) over nickel (Ni) underplate-one microns minimum thickness of nickel (Ni)

    is required. Less than one Micron Nickel (Ni) thickness requires Neltron approval.

    3. Matte Tin (Sn) finishes with out a nickel underplate must meet the following

    requirements. : (note : annealing is not required with a nickel (Ni) underplate.)

    1) Matte Tin (Sn) finishes must meet the plating thickness greater than10 microns.

    2) The finish must undergo an annealing process at a temperature of 130 degrees

    Celsius or higher for a minimum of one hour.

    3) The heat treatment must occur with in two weeks of plating.

    4. Tin-bismuth (SnBi) component finishes are only acceptable with specific Neltron


    5. Noble metal plating is acceptable without pre approval except for silver (Ag).

    6. Silver (Ag) plating Require Neltron Pre-Approval.

    2. Unacceptable Substitutes for Finishes Containing Lead (Pb)

     Unacceptable substitutes for lead (Pb) include but may not be limited to:

    1. Bright and Shiny Tin

    2. Pure Tin (Sn), Matte or Bright, without under plate(unless by specific Neltron

    approval) except for the matte tin finish with subsequent annealing process as

    referenced in section1 above.

    3. Criteria to Distinguish Between Pure Matte and Bright Tin

    Supplier will establish a system to measure and to control characteristics of the tin plating

    known or suspected to influence whisker growth. Neltron requires carbon content 0.005%

    - 0.050%, Grain size 1-5um.

Table 1. Distinguish Between pure Matte and Bright Tin

     Matte Tin Bright Tin

    1 5 Microns 0.0 0.8 Microns Grain Size

    0.005% - 0.050% 0.2% - 1.0 % Carbon Content

    ** We reserve the right to alter this specification.


Green Environmental Program



    Report on the Submitted Samples Said to be: Connector & Cable

    1. Test Requested:

    1. To determine the Cadmium content in the submitted sample.

    2. To determine the Lead content on the submitted sample.

    3. To determine the Mercury content on the submitted sample.

    4. To determine the Hexavalent Chromium content on the submitted sample.

    5. To determine the Cadmium, Lead and Mercury content in the submitted metal


    6. Determination of the PBBs (Polybrominated blphenyls). PBDEs (Polybrominated

    diphenethers) of the submitted sample.

    2. Standards for measurement:

     Detection Limit

     1. Cadmium (Cd) <5ppm

     2. Lead (PB) <100ppm

     3. Mercury (Hg) <5ppm

     4. Hexavalent Chromium (Cn5) <5ppm

     5. Polybrominated biphenyls (PBBs) <5ppm

     6. Polybrominated Diphenylethers(PBDEs) <5ppm

    3. Test Results: Please refer to SGS job No report

     SGS Job NO: 1593009, 1593011, 1592988, 1594039, 1593014, 1593017,

    1594036, 1624095


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