By Jane Berry,2014-04-23 07:31
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    Press information

    with request for publication

    LPKF presents simple metallization for 3D

    interconnect devices

    With the continuous development of laser direct structuring, it is Contact:

    Malte Borges becoming ever more important to make the process easier and more economic. With ProtoPlate LDS, LPKF closes the technological gap Tel. +49 5131 7095-1327

    Fax +49 5131 7095-90 in prototyping for three-dimensional interconnect devices.

     LDS technology has experienced a genuine growth throughout the last

    16.11.2011 few years. Using the LDS process, interconnect devices are made out of

     simple plastic components and a ProtoPaint LDS finish allows plastic 3D

     prototypes to be coated for laser direct structuring. The LPKF Fusion3D

     laser systems then create the circuit structures, and the new ProtoPlate LPKF

    Laser & Electronics AG metallization substantially reduces the processing time. This advancement Osteriede 7 now allows for prototyping of three-dimensional interconnect devices in-30827 Garbsen

    Germany house without the need of extensive chemical knowledge.

     Working metallization is done electroless, and the basic LPKF ProtoPlate Management board

    Dr. Ingo Bretthauer LDS package consists of a beaker, a magnetic mixer, a thermometer, a (Chair/CEO) hood and an exhaust system. The chemical consumables for copper Bernd Lange (CTO)

     plating are part of the LPKF ProtoPlate CU set. The whole set is Kai Bentz (CFO) developed in cooperation with Enthone GmbH, Germany.

     The ProtoPlate LDS process is very simple. First the copper solution is

    Stock: put in a beaker and heated to the target temperature. Then a few mililiters Prime Standard

    ISIN 0006450000 of activator is dropped into the metallization bath to start the solution. From the point of activation, the metallization bath is usable for one to two

     hours. Reprint free of charge, please

    send a copy After the bath is operational, the clean, structured plastic components are ? Other press releases suspended in the bath. Metallization begins after a few minutes.

    Depending on the duration of metallization, uniform copper layers develop

    at a thickness of 3 µm to 10 µm on the component. After attaining the

    desired layer of thickness, the LDS components are removed and rinsed

    off, information on time required is provided with kit. The consumed

    metallization solution can then be collected in the original canister and

    disposed of.

    Dr. Wolfgang John, Director of LDS Process Development, notes that,

    798487246.doc 1

    Press information

    with request for publication

“ProtoPlate metallization is safe and does not require any chemical

    knowledge. Time-to-market is reduced to a fraction of the time normally required and cost substantially drops now that entire prototyping process is considerably faster and easier than ever before.

    LPKF ProtoPlate LDS and ProtoPlate CU are being presented for the first time at the 2011 Productronica Trade Fair and will be available during the first quarter of 2012 in the LPKF product range.

    Simple, safe, easy to operate: The LPKF ProtoPlate LDS allows prototypes of three-dimensional interconnect devices to be plated without extensive chemistry knowledge.

    798487246.doc 2

    Press information

    with request for publication

About LPKF

    LPKF Laser & Electronics AG manufactures machines and laser systems used in electronics fabrication, medical technology, the automotive sector, and the production of solar cells. Around 20 percent of the workforce is engaged in research and development.

About Enthone

    Enthone is a business of Cookson Electronics The company is a global and leading

    supplier of high performance specialty chemicals and coatings. Enthone manufactures, markets and distributes its functional, decorative and electronic processes that are used in printed wiring board, semiconductor, photovoltaic, automotive, energy, aerospace, jewelry, and plumbing applications. For more information, please visit

    798487246.doc 3

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