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smt/pcb & nepcon korea 2005

By Yolanda Daniels,2014-06-15 14:34
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Manufacturer of PCB4,31125.6 %Manufacturer of Display1,3568.1 %Electronic Parts & Components Manufacturer2,37514.1 %Info/Communication Components ...

    SMT/PCB & NEPCON KOREA 2006

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    SMT/PCB & NEPCON KOREA 2006

Organized by : K. Fairs Ltd. The Electronic Times Reed Exhibitions

Sponsored by :

    ?. OUTLINE OF THE SHOW

    SMT/PCB & NEPCON KOREA 2006

    ? Exhibition : Feb. 15 ~ 17, 2006

    - Business Day : Feb. 15 ~ 16

    - Public Day : Feb. 17

    ? Conference : Feb. 15 ~ 17, 2006

    Atlantic & Convention Hall, COEX, Seoul, Korea

     - K. Fairs Ltd. The Electronic Times Reed Exhibitions

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    SMT/PCB & NEPCON KOREA 2006

     Ministry of Commerce, Industry and Energy

     Small & Medium Business Administration

     Korea Electronics Technology Institute

    Small and Medium Industry Promotion Corporation

    The institute of Electronics Engineers of Korea

    Korea Federation of Small and Medium Business

    Electronic Industries Association of Korea

     SMT related Equipment & Materials

     PCB Manufacturing Equipment & Materials

     Electronic Parts Manufacturing Equipment & Materials

     Automatic Machines and Materials for Production of IT Terminals

     Electronic Components & Test/Inspection Equipment

     EMI Control Equipment & Materials

     Microelectronics and Packaging

Other Equipment & Materials

    - BGA/SMD rework system

    - Fume Extraction System

    - Metal Soldering & Desoldering product

    - Forming Machine, etc.

FPD Manufacturing Pavilion

    - Panel Assembly Systems

    - Plate Processing Equipment

    - TFT, LCD Test, Measurement & Repairment Systems

    - Production System / Components / Materials for Organic ELs

    - PDP Production Systems / Components / Materials

    - Cleaning Equipment / ESD safe Product

    - Parts & Materials

    17,658 sqm (890 Booths, 430Companies from 23 countries)

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SMT/PCB & NEPCON KOREA 2006

    Feb. 15 5,433 28.5%

    Feb. 16 6,939 36.4%

    Feb. 17 6,669 35.1%

    Total 100%

    Management 2,396 14.8 %

    Purchase 4,153 25.7 % Sales & Marketing 1,862 11.5 %

    Technical 3,192 19.7 %

    R&D 3,369 20.8 %

    Quality Control 918 5.7 %

    Others 286 1.8 %

    Total 16,176 100.0 % PR Kit. Invitation flyer 18,013 45.5 % TV/Radio Broadcasting 7,619 19.3 %

    Fax/E-mail 1,002 2.5 %

    News Paper 4,243 10.7 %

    Magazine 3,105 7.8 %

    Home Page 2,733 6.9 % Placard & Banner 878 2.2 %

    Others 1,967 5.0 %

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SMT/PCB & NEPCON KOREA 2006

    Total 39,560 100.0 %

    Classification of Company Number Ratio(%)

    Manufacturer of SMT 4,779 28.4 %

    Manufacturer of PCB 4,311 25.6 %

    Manufacturer of Display 1,356 8.1 % Electronic Parts & Components Manufacturer 2,375 14.1 % Info/Communication Components Manufacturer 1,529 9.1%

    Trade 245 1.5 %

    Research 1,147 6.8 %

    Manufacturer 718 4.3 %

    Others 356 2.1 %

    Total 16,816 100.0 %

    Field of Interest Attendee Ratio(%) Equipment & Materials for SMT 7,052 23.5 % Equipment & Materials for PCB 6,276 20.9 % Equipment & Materials for 5,497 18.3 % Display

    Equipment & Materials for 5,071 16.9 % Electronic parts & Components

    Equipment & Materials for

    Information & Components 4,506 15.0 %

    Industry

    Others 1,658 5.5 %

    Total 30,060 100 %

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    SMT/PCB & NEPCON KOREA 2006

    ?. TECHNICAL SEMINAR

     Feb. 15 ~ Feb. 17, 2006

     Rm.402, 403 Conference Center , 4F, COEX

    Apr. 15 685

    Apr. 16 568

    Apr. 17 342

    Total 1,595

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    SMT/PCB & NEPCON KOREA 2006

    Registration 09:00~15:00

    Hak-Kyung Sung

    (Managing Director of 09:20~09:30 Opening Talks Samsung Electronics Co.,

    Ltd) Session Chair: Yong-Bin Sun(Professor of Kyonggi Univ.)

    Young-Joo Ko

    (General Manager of Embedded Passive Technology in Plastic 09:30~10:10 Base PCBDaeduck Electronics Co.,

    Ltd)

    Han-Seo Cho

    (Principal Engineer of Passive Components Embedding 10:10~10:50 Technology Samsung Electro-

    Mechanics Co., Ltd) 10:50~11:00 Coffee Break

    Session Chair Chang-Youl Moon(Doctor of SAIT)

    Jae-Kyung Jang 11:00~11:40 Embedded PCB Trimmer Development (Manager of EO Tchnics

    Co., Ltd)

    Polymer-Ceramic Powder Composite Kyung-Wook Paik 11:40~12:20 Embedded Capacitor Materials for (Professor of KAIST) Organic Substrates Applications

    12:20~13:30 Lunch

    Session Chair Young-Jun Moon(Senior Engineer of Samsung Electronics Co., Ltd)

    Sung-Gue Lee 13:30~14:10 (Director of LG Electronics PCB Embedded Devices Technology

    Co., Ltd)

    Suk-Jin Ham A Review of Wafer-Level Embedded 14:10~14:50 Passive Technology (Doctor of SAIT) 14:50~15:00 Coffee Break

    Session Chair Young-Ho Kim(Professor of Hanyang Univ.)

    Se-Young Jang 15:00~15:40 3D SMT for System Miniaturization (Senior Engineer of

    Samsung Electronics Co.,

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    SMT/PCB & NEPCON KOREA 2006

    Ltd)

    Kenny Lee

    (Managing Director of 3D Package 15:40~16:20

    Stats ChipPac Korea)

    Young-Hyo Eun

    (Senior Engineer of 16:20~17:00 Reliability Study of Package on Package Amkor Tchnology Korea

    Inc.)

    Time Subject Speaker 13:00~13:50 Real Time SMT Line Control System Hyung-Duck, Kim, President

    of Hankuk Valence Co., Ltd. 14:00~14:50 LEAD-FREE SOLDERING Mr. D.S Kim, President of

    TECHNOLOGY & HIGHT GOOD FEEL CO., LTD.

    FREQUENCY SOLDERING IRON TIP

    TECHNOLOGY

    15:00~16:50 ESD Control of SMT/PCB electronic Yoo Yong Hoon, President

    industry IC destructrion, adhesion of Coreinsight Inc.

    of alien substance

    Time Subject Speaker 13:00~13:50 Hand soldering and rework with Mr. son tae sung,

    lead/free solders OK KOREA CO., LTD.

    nd14:00~14:50 2 level underfill Flip-chip and Karl I. Loh, Zymet, USA

    CSP Underfill application

    (interpretation service)

    15:00~15:50 3D X-ray with Semiconductor and Dr. Sangchul Lee

    SMT field

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SMT/PCB & NEPCON KOREA 2006

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