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Wave soldering SPECIFICATIONS -2

By Laurie Bradley,2014-10-17 01:30
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Wave soldering SPECIFICATIONS -2

    Spécifications d'assemblage cartes imprimées

    îlot : désignation :

    WAVE SOLDERING SOLDERING THT Components metalized holes

    Criteria Illustration Limits Joint is complete and

    slightly above the edge of Preferred the hole

Joint is filled up to ? of

    the height of the metalized Acceptable hole

    page : 1 / 4

    Spécifications d'assemblage cartes imprimées îlot : désignation :

    WAVE SOLDERING SOLDERING Specific requirements

    Criteria Illustration Limits

    Preferred Solder on the risks : electrical fluorescent tube flash with the contacts : flat surface contacts

    Not Acceptable Solder on Gold surface risks : impossible to for different contacts connect the plug

    Not Acceptable Solder on the terminal risks : impossible to blocks or contacts screw the lamp

    page : 2 / 4

    Spécifications d'assemblage cartes imprimées

    îlot : désignation :

    WAVE SOLDERING SOLDERING Visual Aspect of PCBA

    Criteria Illustration Limits

    Not Acceptable Micro-bowls risks : short circuits

     "splash", scories from Not Acceptable

    risks : short circuits solder alloy bath

    Not Acceptable

    risks : reactivation of the

    flux creating a short or Flux ? white ? marks

    electrical flash.

    Not Acceptable

    Solder joint on the upper risks: drop inside the

    product and short face of the PCBA

    circuit

    Not Acceptable

    risks : not able to Flatness : Deformed PCBA produce on the next

    machines

    page : 3 / 4

    Spécifications d'assemblage cartes imprimées

    îlot : désignation :

    WAVE SOLDERING COMPARISON LEAD AND LEADED PROCESS

    ASPECT OF LEADED SOLDER JOINTS ASPECT OF LEAD-FREE SOLDER JOINT

    SHINY MAT

    page : 4 / 4

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