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Wave soldering SPECIFICATIONS-1

By Julie Kelley,2014-10-17 01:39
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Wave soldering SPECIFICATIONS-1

    Spécifications d'assemblage cartes imprimées

    îlot : désignation :

    WAVE SOLDERING SOLDERING SMT Components : "chip", "melf", leads in "L" and "J" shape

    Criteria Illustration Limits Homogeneous solder Preferedjoint

    Not acceptable Round Shape of the risks : bad soldering solder joint (convex) or between alloy and covering the connection components

Incomplete solder joint :

    lack of alloy or not Not Acceptable efficient wetting

Short circuit on the

    components or between Not Acceptable the leads

    page : 1 / 2

    Spécifications d'assemblage cartes imprimées

    îlot : désignation :

    WAVE SOLDERING SOLDERING THT components

    Criteria Illustration Limits Homogeneous joint with Preferedleads end visible

    Solder link between Not acceptable

     connections

    Poor wettability Not Acceptable

    Solder spikes Not Acceptable

    page : 2 / 2

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